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| 1/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. secondary ldo regulators secondary dual-output (fixed/variable) ldo regulators ba3259hfp,BA30E00WHFP description the ba3259hfp and BA30E00WHFP are 2-output, low-saturation regu lators. these units have both a 3.3 v fixed output as well as a variable output with a voltage accuracy of 2%, and incorporate an overcurrent protection circuit to prevent ic destruction due to output shorting along wi th a tsd (thermal shut down) circuit to protect the ic from thermal destruction caused by overloading. features 1) output voltage accuracy: 2%. 2) reference voltage accuracy: 2% 3) output current capacity: 1 a (ba3259hfp), 0.6 a (BA30E00WHFP) 4) ceramic capacitor can be used to prevent output oscillation (ba3259hfp) 6) low dissipation with two voltage input supported (BA30E00WHFP) 7) built-in thermal shutdown circuit 8) built-in overcurrent protection circuit applications available to all commercial devices, such as fpd, tv, and pc sets besides dsp power supplies for dvd and cd sets. product lineup part number output voltage vo1 output voltage vo2 output current io1 output current io2 package ba3259hfp 3.3 v 0.8 v to 3.3 v 1 a max 1 a max hrp5 BA30E00WHFP 3.3 v 0.8 v to 3.3 v 0.6 a max 0.6 a max hrp7 absolute maxi mum ratings ba3259hfp BA30E00WHFP parameter symbol ratings units parameter symbol ratings units applied voltage vcc 15 *1 v applied voltage vcc 18 *1 v power dissipation pd 2300 *2 mw power dissipation pd 2300 *2 mw operating temperature range topr 0 to 85 operating temperature range topr ? 25 to 105 ambient storage temperature range ts t g ? 55 to 150 ambient storage temperature range ts t g ? 55 to 150 maximum junction temperature tjmax 150 maximum junction temperature tjmax 150 *1 must not exceed pd. *2 derated at 18.4 mw/ at ta>25 when mounted on a glass epoxy board (70 mm ? 70 mm ? 1.6 mm). no.11026ebt02
technical note 2/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? technical note 3/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? technical note 4/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 output current ? ? ? ? ? technical note 5/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 1. 8 0 2 4 6 8 1012141618 supply voltage ? ? ? ? ? technical note 6/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP ? ? technical note 7/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP function explanation 1) two-input power supply (BA30E00WHFP) the input voltages (vcc1 and vcc2) supply power to two outputs (vo1 and vo2, respectively). the power dissipation between the input and output pins can be suppres sed for each output according to usage. 2) standby function (BA30E00WHFP) the standby function is operated through the en pin. output is tu rned on at 2.0 v or higher and tu rned off at 0.8 v or lower. thermal design if the ic is used under the conditions of ex cess of the power dissipation, the chip te mperature will rise, which will have an adverse effect on the electrical characteri stics of the ic, such as a reduction in current capability. furthermore, if the temperature exceeds t jmax , element deterioration or damage may occur. im plement proper thermal designs to ensure that the power dissipation is within the permissible range in orde r to prevent instantaneous ic damage resulting from heat and maintain the reliability of the ic for long-term operation. refe r to the power derating characteristics curves in fig. 27. ? power consumption pc (w) calculation method: ba3259hfp BA30E00WHFP the icc (circuit current) varies with the load. refer to the above and implement proper thermal designs so that the ic will not be used under conditions of excess power dissipation pd under all operating temperatures. vcc gnd vo1 vo2 controller icc i p vcc vcc io1 io2 3.3 v output 0.8 v to 3.3 v output power tr power tr vcc1 gnd io1 io2 controller icc1+icc2 vcc1 vcc2 io1 io2 3.3 v output 0.8 v to 3.3 v output vcc2 i b 1 i b 2 power tr power tr ? power consumption of power transistor on vol1 (3.3 v output) pc1=(vcc1 ? vo1) ? io1 ? power consumption of power transistor on vo2 (variable output ) pc2=(vcc2 ? vo2) ? io2 ? power consumption by circuit current pc3=vcc1 ? icc1 + vcc2 ? icc2 ? pc=pc1 + pc2 + pc3 * vcc1, vcc2: applied voltage io1: load current on 3.3 v output side io2: load current on variable output side icc1, icc2: circuit currents ? power consumption of 3.3 v power transistor pc1=(vcc ? 3.3) ? io1 ? power consumption of vo2 power transistor pc2=(vcc ? vo2) ? io2 ? power consumption by circuit current pc3=vcc ? icc ? pc=pc1 + pc2 + pc3 * vcc: applied voltage io1: load current on vo1 side io2: load current on vo2 side icc: circuit current 5v vcc vo1 vo2 reg1 reg2 3.3 v/0.3 a 1.8 v/0.3 a power loss between input and output (vcc ? vo1) ? io1 + (vcc ? vo2) ? io2 = (5 ? 3.3) ? 0.3 + (5 ? 1.8) ? 0.3 = 0.51w + 0.96w = 1.47w ? single 5v input results in decreased efficiency power loss between input and output (vcc1 ? vo1) ? io1 + (vcc2 ? vo2) ? io2 = (5 ? 3.3) ? 0.3 + (5 ? 1.8) ? 0.3 = 0.51w + 0.36w = 0.87w reduced power loss by 0.6w. ? additional 3v input improves efficiency 5v vcc vo1 vo2 reg1 reg2 3v 3.3 v/0.3 a 1.8 v/0.3 a conventional efficiency comparison: 5v single input vs. 5v/3v two inputs ? regulator with single input and two outputs ? regulator with two inputs and two outputs (vo2=1.8v, io1=io2=0.3a) current 8 10 (3) 7.3w 9 7 6 5 4 3 2 1 0 power dissipation: pd [w] ambient temperature: ta [c] 25 50 75 100 125 150 board size: 70 mm ? 70 mm ? 1.6 mm (with a thermal via incorporated by the board) board surface area: 10.5 mm ? 10.5 mm (1) 2-layer board (backside copper foil area: 15 mm ? 15 mm) (2) 2-layer board (backside copper foil area: 70 mm ? 70 mm) (3) 4-layer board (backside copper foil area: 70 mm ? 70 mm) 0 (2) 5.5w (1) 2.3w fig. 27 ambient temperature vs. power dissipation fig.28 ba3259hfp esr fig.29 BA30E00WHFP esr io [ma] 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 esr [? ] 0.02 0.05 0.2 5.0 unstable region 10.0 stable region 0.7 unstable region 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 io [ma] esr [? ] stable region 0.02 0.05 0.2 5.0 unstable region 10.0 technical note 8/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP input / output equivalent circuits ba3259hfp BA30E00WHFP fig.30 ba3259hfp i/o equivalent circuits fig.31 BA30E00WHFP i/o equivalent circuit explanation of external components ba3259hfp 1) vcc (pin 1) it is recommended that a ceramic capacitor with a capacitanc e of approximately 3.3f is pl aced between vcc and gnd at a position closest to the pins as possible. 2) vo (pins 4 and 5) insert a capacitor between vo and gnd in order to prevent output oscillation. the capa citor may oscillate if the capacitance changes as a result of temper ature fluctuations. therefor e, it is recommended that a ceramic capacitor with a temperature coefficient of x5r or above and a maximum capaci tance change (resulting from temperature fluctuations) of 10% be used. the capacitance should be between 1f and 1,000f. (refer to fig. 28.) ba33e00hfp 1) vcc1 (pin 3) and vcc2 (pin 2) insert capacitors with a capacitance of 1f between vcc1 and gnd and vcc2 and gnd. the capacitance value will vary depending on the application. be sure to implement designs with sufficient margins. 2) vo1 (pin 5) and vo2 (pin 6) insert a capacitor between vo and gnd in order to prevent osc illation. the capacitance of the capacitor may greatly vary with temperature changes, making it impossible to completely prevent oscillation. therefor e, use a tantalum aluminum electrolytic capacitor with a low esr (equivalent serial resi stance) that ensures good performance characteristics at low temperatures. the output oscillate s if the esr is too high or too low. refer to the esr characteristics in fig. 29 and operate the ic within the stable operat ing region. if there is a sudden load change, use a capacitor with a higher capacitance. a capacitance between 47f and 1,000f is recommended. vcc vo1 vo2 adj vcc vcc1 vo1 vcc1 vcc2 vo2 adj technical note 9/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP ( pina ) gnd parasitic element gnd (pinb) b c e other adjacent elements notes for use 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3) thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pins are shorted together. 5) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 7) regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers wi th the n layers of other elem ents, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. 8) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 9) thermal shutdown circuit (tsd) this ic incorporates a built-in thermal shutdown circuit for protection against thermal destruction. should the junction temperature (tj) reach t he thermal shutdown on temperature threshold, t he tsd will be activated, turning off all output power elements. the circuit will automatically reset once the ch ip's temperature tj drops below the threshold temperature. operation of the thermal sh utdown circuit presumes that the ic's absolute maximum ratings have been exceeded. application designs should never make use of the thermal shutdown circuit. 10) overcurrent protection circuit an overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents. continued use of the protecti on circuits should be avoided. please note that current increases negatively impact the temperature. 11) damage to the internal circuit or element may occur when the po larity of the vcc pin is opposit e to that of the other pins inapplications. (i.e. vcc is shorted with the g nd pin while an external capacitor is charged.) use a maximum capacitance of 1000 mf for the output pins. insert ing a diode to prevent back-current flow in series with vcc or bypass diodes between vcc and each pin is recommended. vcc output pin diode for preventing back current flow bypass diode gnd p n p n n p p a ? gnd n p p b ??? (npn) b n e c gnd p transistor (npn) resistor (pin a) p su b str at e parasitic element (pin b) p substrate n p n parasitic element fig. 32 bypass diode fig. 33 example of simple bipolar ic architecture technical note 10/10 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ba3259hfp,BA30E00WHFP ordering part number b a 3 2 5 9 h f p - t r part no. part no. 3259 30e00w package hfp: hrp5 hrp7 packaging and forming specification tr: embossed tape and reel direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. |
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